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IBM X3200 ¸ðµ¨ÀÔ´Ï´Ù.
»ç¿ëÁßÀÎ ¸Þ¸ð¸®°¡ 1G (512M *2) PC2 5300E 555 12 ÀÔ´Ï´Ù.
PC2-5300 CL5 ECC DDR2 SDRAM DIMM
PC2-5300 CL5 ECC DDR2 667MHz SR RDIMM
1. ¿©±â¼ SDRAM DIMM °ú SR RDIMM Â÷ÀÌ°¡ ÀÖ³ª¿ä?
2. E : Unbuffered DIMM(UDIMM), with ECC (x72 bit module data bus)
P : Registered DIMM(RDIMM), with address/command parity function
Á¦ ¸ÞÀκ¸µå¿¡¼´Â P´Â ÀνÄÀ» ÇÒ¼ö ÀÖ´ÂÁö ±Ã±ÝÇÕ´Ï´Ù.
·¹Áö½ºÅÍ ¸Þ¸ð¸®´Â ¸¹Àº°Í °°Àºµ¥ 5300E À̰Ŵ ã±â°¡ Èûµé¾î¼¿ä
±×¸®°í Ãß°¡ÀûÀ¸·Î ¸ÞÀκ¸µå°¡ Áö¿øÇÏ´Â CPU¿Í RAM ¿¡ °üÇÑ Á¤º¸µµ ¾Ë·ÁÁÖ½Ã¸é °¨»çÇÏ°Ú½À´Ï´Ù.
everestº¸°í¼ ÷ºÎÇß½À´Ï´Ù.
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¸Ó´õº¸µå ¼Ó¼º:
¸Ó´õº¸µå ID <DMI>
¸Ó´õº¸µå À̸§ IBM M31IX
FSB ¼Ó¼º:
¹ö½º À¯Çü Intel AGTL+
¹ö½ºÆø 64 ºñÆ®
½ÇÁ¦ Ŭ·° 267 MHz (QDR)
À¯È¿ Ŭ·° 1066 MHz
´ë¿ªÆø 8532 MBps
¸Þ¸ð¸® ¹ö½º ¼Ó¼º:
¹ö½º À¯Çü Dual DDR2 SDRAM
¹ö½ºÆø 128 ºñÆ®
DRAM:FSB ºñÀ² 10:8
½ÇÁ¦ Ŭ·° 333 MHz (DDR)
À¯È¿ Ŭ·° 667 MHz
´ë¿ªÆø 10665 MBps
Ĩ¼¼Æ® ¹ö½º ¼Ó¼º:
¹ö½º À¯Çü Intel Direct Media Interface
[ À§(North) ºê¸®Áö: Intel Mukilteo-2 3000 ]
À§(North) ºê¸®Áö ¼Ó¼º:
À§(North) ºê¸®Áö Intel Mukilteo-2 3000
Áö¿øµÇ´Â FSB ¼Óµµ FSB533, FSB800, FSB1066
¸Þ¸ð¸® À¯Çü(Áö¿ø) DDR2-400 SDRAM, DDR2-533 SDRAM, DDR2-667 SDRAM
ÃÖ´ë ¸Þ¸ð¸®¾ç 8 GB
¸®ºñÁ¯ / Stepping C0 / A0
ÆÐÅ°Áö À¯Çü 1202 Pin FC-BGA
ÆÐÅ°Áö Å©±â 3.4 cm x 3.4 cm
ÄÚ¾î Àü¾Ð 1.5 V
In-Order Queue Depth 12
¸Þ¸ð¸® Á¦¾î±â:
ŸÀÔ Dual Channel (128 ºñÆ®)
È°¼ºÈ ¸ðµå Dual Channel (128 ºñÆ®)
¸Þ¸ð¸® ŸÀ̹Ö:
CAS Latency (CL) 5T
RAS To CAS Delay (tRCD) 5T
RAS Precharge (tRP) 5T
RAS Active Time (tRAS) 15T
Row Refresh Cycle Time (tRFC) 35T
Read To Precharge Delay (tRTP) 5T
Write To Precharge Delay (tWTP) 13T
Refresh Period (tREF) 7.8 us
¿À·ù ¼öÁ¤:
ECC Áö¿øµÊ, »ç¿ëÇÔ
ChipKill ECC Áö¿ø ¾È µÊ
RAID Áö¿ø ¾È µÊ
ECC Scrubbing Áö¿ø ¾È µÊ
Áñ°Å¿î Àú³á º¸³»¼¼¿ä
ªÀº±Û Àϼö·Ï ½ÅÁßÇÏ°Ô.
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